High-frequency signal transmission line

ABSTRACT

Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈ 1  and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ∈ 2  higher than the relative dielectric constant ∈ 1  and is provided on the first principal surface so as to overlap the opening.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a high-frequency signal transmissionline and more particularly relates to a high-frequency signaltransmission line including a ground conductor and a signal line.

2. Description of the Related Art

In a high-frequency signal transmission line having a striplinestructure in which a signal line is sandwiched between ground conductorsfrom above and below, due to the reason described below, the line widthof the signal line is increased in order to decrease a high-frequencyresistance value of the signal line. More specifically, when ahigh-frequency signal flows through the signal line, the high-frequencysignal flows in a concentrated manner through the vicinity of thesurface of the signal line due to a skin effect. In addition, when thehigh-frequency signal flows through the signal line, a high-frequencysignal flows also through the ground conductors in a direction oppositeto that of the high-frequency signal due to electromagnetic induction.The high-frequency resistance value of such a high-frequency signaldecreases, if the surface area of the signal line and the area of aportion of each ground conductor which the signal line faces increaseand conductor loss in the signal line and each ground conductordecreases. Therefore, in the high-frequency signal transmission line,the line width of the signal line is increased in order to decrease thehigh-frequency resistance value of the signal line.

However, when the line width of the signal line is increased, the areaof a portion where the signal line and each ground conductor face eachother increases, and a capacitance occurring between the signal line andthe ground conductor increases. Thus, in order to set the high-frequencysignal transmission line so as to have a predetermined impedance, thedistance between the signal line and each ground conductor is increasedand the capacitance is decreased. However, when the distance between thesignal line and each ground conductor is increased, the thickness of thehigh-frequency signal transmission line increases and it becomesdifficult to bend and use the high-frequency signal transmission line.

Thus, it is considered that the signal line and each ground conductorare not arranged to face each other. Hereinafter, this will be describedin more detail with reference to the drawing. FIG. 18 is a diagram of ahigh-frequency signal transmission line 500 in which a signal line 502is exposed from a ground conductor 504, as seen in a planar view from alamination direction.

As shown in FIG. 18, the high-frequency signal transmission line 500includes the signal line 502 and the ground conductors 504 and 506. Thesignal line 502 is a line-shaped conductor. The ground conductor 506 isprovided on the lower side of the signal line 502 in the laminationdirection and faces the signal line 502 through a dielectric layer. Theground conductor 504 is provided on the upper side of the signal line inthe lamination direction and has an opening. The signal line 502 islocated in the opening when being seen in a planar view from the upperside in the lamination direction.

In the high-frequency signal transmission line 500 shown in FIG. 18, thesignal line 502 and the ground conductor 504 do not overlap each otherwhen being seen in a planar view from the lamination direction. Thus, acapacitance occurring between the signal line 502 and the groundconductor 504 in the high-frequency signal transmission line 500 issmaller than a capacitance occurring between a signal line and a groundconductor in a high-frequency signal transmission line in which thesignal line and the ground conductor overlap each other. Due to this, inthe high-frequency signal transmission line 500, it is possible todecrease the distance between the signal line 502 and the groundconductor 504. As a result, in the high-frequency signal transmissionline 500, the thickness of the high-frequency signal transmission line500 can be decreased, and it becomes possible to bend and use thehigh-frequency signal transmission line 500.

However, the high-frequency signal transmission line 500 has a problemthat unwanted radiation from the signal line 502 occurs. The signal line502 does not overlap the ground conductor 504. Thus, an electromagneticfield generated by a current flowing through the signal line 502 is notabsorbed by the ground conductor 504 and is radiated through the openingto the outside of the high-frequency signal transmission line 500, andunwanted radiation occurs.

As a high-frequency signal transmission line that can solve the aboveproblem, for example, a flexible board described in Japanese UnexaminedPatent Application Publication No. 2007-123740 is known. FIG. 19 is adiagram of a flexible board 600 described in Japanese Unexamined PatentApplication Publication No. 2007-123740, as seen in a planar view from alamination direction.

The flexible board 600 includes a signal line 602 and a ground layer604. The signal line 602 is a line-shaped conductor. The ground layer604 is laminated on the upper side of the signal line 602 in thelamination direction via a dielectric layer. In addition, although notshown, a ground layer is provided on the lower side of the signal line602 in the lamination direction. In the flexible board 600, a pluralityof openings 606 is provided in the ground layer 604. The openings 606have rectangular shapes and are arranged on the signal line 602 in aline. Thus, the signal line 602 partially overlaps the ground layer 604when seen in a planar view from the upper side in the laminationdirection. As a result, in the flexible board 600, since the signal line602 overlaps a portion of the ground conductor 604 where no opening isformed, unwanted radiation from the signal line 602 is reduced in thisportion.

However, in the flexible board 600 described in Japanese UnexaminedPatent Application Publication No. 2007-123740 as well, unwantedradiation occurs through the openings 606.

SUMMARY OF THE INVENTION

Therefore, preferred embodiments of the present invention significantlyreduce and prevent unwanted radiation in a high-frequency signaltransmission line that includes a ground conductor provided with anopening that overlaps a signal line.

A high-frequency signal transmission line according to an aspect of apreferred embodiment of the present invention includes an elementassembly having a first relative dielectric constant and including afirst principal surface and a second principal surface; a line-shapedsignal line provided within the element assembly; a first groundconductor provided in the element assembly and on the first principalsurface side with respect to the signal line and facing the signal line,the first ground conductor being provided with a first opening thatoverlaps the signal line; and a first high dielectric constant layerhaving a second relative dielectric constant higher than the firstrelative dielectric constant and provided on the first principal surfaceso as to overlap the first opening.

According to various preferred embodiments of the present invention,unwanted radiation is reduced in a high-frequency signal transmissionline that includes a ground conductor provided with an opening thatoverlaps a signal line.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an external perspective view of a high-frequency signaltransmission line according to a preferred embodiment of the presentinvention.

FIG. 2 is an exploded diagram of a dielectric element assembly of thehigh-frequency signal transmission line in FIG. 1.

FIG. 3 is a cross-sectional structure diagram of the high-frequencysignal transmission line in FIG. 1.

FIG. 4 is a cross-sectional structure diagram of the high-frequencysignal transmission line.

FIG. 5A is an external perspective view of a connector of thehigh-frequency signal transmission line.

FIG. 5B is a cross-sectional structure diagram of a connector of thehigh-frequency signal transmission line.

FIG. 6A is diagram of an electronic device in which the high-frequencysignal transmission line is used, as seen in a planar view from a y-axisdirection.

FIG. 6B is diagram of an electronic device in which the high-frequencysignal transmission line is used, as seen in a planar view from a z-axisdirection.

FIG. 7 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a first modified example of a preferredembodiment of the present invention.

FIG. 8 is a diagram when the high-frequency signal transmission line inFIG. 7 is seen through from a z-axis direction.

FIG. 9 is an equivalent circuit diagram of a portion taken out from thehigh-frequency signal transmission line according to the first modifiedexample of a preferred embodiment of the present invention.

FIG. 10 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a second modified example of a preferredembodiment of the present invention.

FIG. 11 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a third modified example of a preferredembodiment of the present invention.

FIG. 12 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a fourth modified example of a preferredembodiment of the present invention.

FIG. 13 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a fifth modified example of a preferredembodiment of the present invention.

FIG. 14 is a diagram when the high-frequency signal transmission line inFIG. 13 is seen through from a z-axis direction.

FIG. 15 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a sixth modified example of a preferredembodiment of the present invention.

FIG. 16 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to a seventh modified example of a preferredembodiment of the present invention.

FIG. 17 is an exploded diagram of a laminate of a high-frequency signaltransmission line according to an eighth modified example of a preferredembodiment of the present invention.

FIG. 18 is a diagram of a high-frequency signal transmission line inwhich a signal line is exposed from a ground conductor, as seen in aplanar view from a lamination direction.

FIG. 19 is a diagram of a flexible board described in JapaneseUnexamined Patent Application Publication No. 2007-123740, as seen in aplanar view from a lamination direction.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, high-frequency signal transmission lines according topreferred embodiments of the present invention will be described withreference to the drawings.

(Configuration of High-Frequency Signal Transmission Line)

Hereinafter, the configuration of a high-frequency signal transmissionline according to a preferred embodiment of the present invention willbe described with reference to the drawings. FIG. 1 is an externalperspective view of the high-frequency signal transmission line 10according to the preferred embodiment of the present invention. FIG. 2is an exploded diagram of a dielectric element assembly 12 of thehigh-frequency signal transmission line 10 in FIG. 1. FIG. 3 is across-sectional structure diagram of the high-frequency signaltransmission line 10 in FIG. 1. FIG. 4 is a cross-sectional structurediagram of the high-frequency signal transmission line 10. FIG. 5A is anexternal perspective view of a connector 100 b of the high-frequencysignal transmission line 10. FIG. 5B is a cross-sectional structurediagram of a connector 100 b of the high-frequency signal transmissionline 10. In FIGS. 1 to 5B, a lamination direction of the high-frequencysignal transmission line 10 is defined as a z-axis direction. Inaddition, a longitudinal direction of the high-frequency signaltransmission line 10 is defined as an x-axis direction, and a directionorthogonal to the x-axis direction and the z-axis direction is definedas a y-axis direction.

The high-frequency signal transmission line 10 is used, for example, forconnecting two high-frequency circuits in an electronic device such as acellular phone. As shown in FIGS. 1 to 3, the high-frequency signaltransmission line 10 includes the dielectric element assembly 12, aprotective layer 14, a high dielectric constant layer 15, externalterminals 16 (16 a and 16 b), a signal line 20, ground conductors 22 and24, via-hole conductors b1 to b4 and B1 to B3, and connectors 100 a and100 b.

The dielectric element assembly 12 is a plate-shaped flexible memberhaving two principal surfaces. The dielectric element assembly 12extends in the x-axis direction when been seen in a planar view from thez-axis direction, and includes a line portion 12 a and connectionportions 12 b and 12 c. The dielectric element assembly 12 is a laminatecomposed of dielectric sheets (insulating material layers) 18 (18 a to18 c) shown in FIG. 2 which are laminated in this order from thepositive direction side to the negative direction side in the z-axisdirection. The dielectric sheets 18 constituting the dielectric elementassembly 12 are formed from a liquid crystal polymer and have a relativedielectric constant ∈1 of about 3. It is noted that other than theliquid crystal polymer, the dielectric sheets 18 can be formed from athermoplastic resin having flexibility, such as polyimide. Hereinafter,as shown in FIG. 4, a principal surface of the dielectric elementassembly 12 on the negative direction side in the z-axis direction isreferred to as a front surface (first principal surface), and aprincipal surface of the dielectric element assembly 12 on the positivedirection side in the z-axis direction is referred to as a back surface(second principal surface).

The line portion 12 a extends in the x-axis direction. The connectionportions 12 b and 12 c are connected to an end of the line portion 12 aon the negative direction side in the x-axis direction and an end of theline portion 12 a on the positive direction side in the x-axisdirection, respectively, to form a rectangular shape. The widths of theconnection portions 12 b and 12 c in the y-axis direction are largerthan the width of the line portion 12 a in the y-axis direction.

The dielectric sheets 18 extend in the x-axis direction when being seenin a planar view from the z-axis direction, and have the same shape asthat of the dielectric element assembly 12. The total thickness T1 ofthe dielectric sheets 18 a and 18 b is larger than the thickness T2 ofthe dielectric sheet 18 c as shown in FIG. 4. For example, afterlamination of the dielectric sheets 18 a to 18 c, the thickness T1 is 50to 300 μm. In the present preferred embodiment, the thickness T1 is 150μm. In addition, the thickness T2 is 10 to 100 μm. In the presentpreferred embodiment, the thickness T2 is 50 μm. Hereinafter, aprincipal surface of each dielectric sheet 18 on the negative directionside in the z-axis direction is referred to as a front surface, and aprincipal surface of each dielectric sheet 18 on the positive directionside in the z-axis direction is referred to as a back surface.

In addition, the dielectric sheet 18 a is composed of a line portion 18a-a and connection portions 18 a-b and 18 a-c. The dielectric sheet 18 bis composed of a line portion 18 b-a and connection portions 18 b-b and18 b-c. The dielectric sheet 18 c is composed of a line portion 18 c-aand connection portions 18 c-b and 18 c-c. The line portions 18 a-a, 18b-a, and 18 c-a constitute the line portion 12 a. The connectionportions 18 a-b, 18 b-b, and 18 c-b constitute the connection portion 12b. The connection portions 18 a-c, 18 b-c, and 18 c-c constitute theconnection portion 12 c.

The external terminal 16 a is a rectangular conductor provided near thecenter of the back surface of the connection portion 18 a-b, as shown inFIGS. 1 and 2. The external terminal 16 b is a rectangular conductorprovided near the center of the front surface of the connection portion18 a-c, as shown in FIGS. 1 and 2. The external terminals 16 a and 16 bare produced from a metal material containing silver or copper as aprincipal component and having a low specific resistance. In addition,gold plating is applied to the front surfaces of the external terminals16 a and 16 b.

The signal line 20 is a line-shaped conductor provided within thedielectric element assembly 12 as shown in FIG. 2, and extends on thefront surface of the dielectric sheet 18 b in the x-axis direction. Bothends of the signal line 20 overlap the external terminals 16 a and 16 b,respectively, when being seen in a planar view from the z-axisdirection. The line width of the signal line 20 is, for example, 100 to500 μm. In the present preferred embodiment, the line width of thesignal line 20 is 240 μm. The signal line 20 is produced from a metalmaterial containing silver or copper as a principal component and havinga low specific resistance.

The ground conductor 24 (first ground conductor) is provided within thedielectric element assembly 12 and on the first principal surface sidewith respect to the signal line 20 (namely, on the negative directionside in the z-axis direction) as shown in FIG. 2, and more specifically,is provided on the front surface of the dielectric sheet 18 c. Thus, theground conductor 24 is provided on a first front surface of thedielectric element assembly 12. The ground conductor 24 extends on thefront surface of the dielectric sheet 18 c in the x-axis direction andfaces the signal line 20 through the dielectric sheet 18 c. The groundconductor 24 is produced from a metal material containing silver orcopper as a principal component and having a low specific resistance.

In addition, the ground conductor 24 is composed of a line portion 24 aand terminal portions 24 b and 24 c. The line portion 24 a is providedon the front surface of the line portion 18 c-a and extends in thex-axis direction. The line portion 24 a has a ladder shape byalternately providing, along the signal line 20, a plurality of openings30 where no conductor layer is formed and a plurality of bridge portions60 that are portions where a conductor layer is formed. The openings 30have rectangular shapes when being seen in a planar view from the z-axisdirection, and overlap the signal line 20, as shown in FIGS. 2 and 4.Thus, the signal line 20 alternately overlaps the openings 30 and thebridge portions 60 when being seen in a planar view from the z-axisdirection. In addition, the openings 30 are arranged at equal intervals.

The terminal portion 24 b is provided on the front surface of the lineportion 18 c-b and formed in a rectangular ring. The terminal portion 24b is connected to an end of the line portion 24 a on the negativedirection side in the x-axis direction. The terminal portion 24 c isprovided on the front surface of the line portion 18 c-c and formed in arectangular ring. The terminal portion 24 c is connected to an end ofthe line portion 24 a on the positive direction side in the x-axisdirection.

The ground conductor 22 (second ground conductor) is provided within thedielectric element assembly 12 and on the negative direction in thez-axis direction with respect to the signal line 20, as shown in FIG. 2,and more specifically, is provided on the back surface of the dielectricsheet 18 a that is closest to the back surface of the dielectric elementassembly 12. Thus, the ground conductor 22 is provided on a second frontsurface of the dielectric element assembly 12. The ground conductor 22extends on the back surface of the dielectric sheet 18 a in the x-axisdirection and faces the signal line 20 through the dielectric sheets 18a and 18 b. The ground conductor 22 faces the ground conductor 24through the signal line 20. Substantially no opening is provided in aportion of the ground conductor 22 which faces the signal line 20. Inother words, the ground conductor 22 is an electrode continuouslyextending along the signal line 20 in the line portion 12 a in thex-axis direction, namely, is a so-called solid electrode. However, theground conductor 22 does not need to fully cover the line portion 12 a,and, for example, a micro hole or the like may be provided at apredetermined position in the ground conductor 22 for releasing gas thatoccurs when thermoplastic resins of the dielectric sheets 18 arethermocompression-bonded. The ground conductor 22 is produced from ametal material containing silver or copper as a principal component andhaving a low specific resistance.

In addition, the ground conductor 22 is composed of a line portion 22 aand terminal portions 22 b and 22 c. The line portion 22 a is providedon the back surface of the line portion 18 a-a and extends in the x-axisdirection. The terminal portion 22 b is provided on the back surface ofthe line portion 18 a-b and formed in a rectangular ring surrounding theperiphery of the external terminal 16 a. The terminal portion 22 b isconnected to an end of the line portion 22 a on the negative directionside in the x-axis direction. The terminal portion 22 c is provided onthe back surface of the line portion 18 a-c and formed in an annularrectangular shape surrounding the periphery of the external terminal 16b. The terminal portion 22 c is connected to an end of the line portion22 a on the positive direction side in the x-axis direction.

As described above, the signal line 20 is sandwiched between the groundconductors 22 and 24 via the dielectric layers 18 a to 18 c from bothsides in the z-axis direction. In other words, the signal line 20 andthe ground conductors 22 and 24 form a tri-plate type striplinestructure. In addition, the interval between the signal line 20 and theground conductor 22 is substantially equal to the total thickness T1 ofthe dielectric sheets 18 a and 18 b as shown in FIG. 4, and is, forexample, 50 μm to 300 μm. In the present preferred embodiment, theinterval between the signal line 20 and the ground conductor 22 is 150μm. Meanwhile, the interval between the signal line 20 and the groundconductor 24 is substantially equal to the thickness T2 of thedielectric sheet 18 c as shown in FIG. 4, and is, for example, 10 μm to100 μm. In the present preferred embodiment, the interval between thesignal line 20 and the ground conductor 24 is 50 μm. In other words, thethickness T1 is designed so as to be larger than the thickness T2.

As described above, when the thickness T1 is made larger than thethickness T2, a capacitance occurring between the ground conductor 22and the signal line 20 is reduced, and the line width of the signal line20 for setting a predetermined impedance (e.g., 50Ω) can be increased.Thus, transmission loss can be reduced, and hence the electricalcharacteristics of the high-frequency signal transmission line can beimproved. In the present preferred embodiment, a capacitance occurringbetween the ground conductor 22 and the signal line 20 is a main factorfor impedance designing, and the ground conductor 24 is used as a groundconductor for reducing radiation of a signal, for impedance designing.In other words, with the ground conductor 22 and the signal line 20, acharacteristic impedance is set so as to be high (e.g., 70Ω), and aregion having a low impedance (e.g., 30Ω) is provided in a portion ofthe high-frequency signal transmission line by adding the groundconductor 24. By so doing, the impedance of the entire high-frequencysignal transmission line is designed so as to be a predeterminedimpedance (e.g., 50Ω).

The via-hole conductors b1 and b3 extend through the connection portions18 a-b and 18 b-b of the dielectric sheets 18 a and 18 b, respectively,in the z-axis direction to form a single via hole, and connect theexternal terminal 16 a to an end of the signal line 20 on the negativedirection side in the x-axis direction. The via-hole conductors b2 andb4 extend through the connection portions 18 a-c and 18 b-c of thedielectric sheets 18 a and 18 b, respectively, in the z-axis directionto form a single via-hole conductor, and connect the external terminal16 b to an end of the signal line 20 on the positive direction side inthe x-axis direction. Thus, the signal line 20 is connected between theexternal terminals 16 a and 16 b. The via-hole conductors b1 to b4 areproduced from a metal material containing silver or copper as aprincipal component and having a low specific resistance.

The via-hole conductors B1 to B3 extend through the line portions 18 a-ato 18 c-a of the dielectric sheets 18 a to 18 c, respectively, in thez-axis direction, and a plurality of the via-hole conductors B1, B2, orB3 is provided in each of the line portions 18 a-a to 18 c-a. Thevia-hole conductors B1 to B3 are connected to each other to form asingle via-hole conductor and connect the ground conductor 22 to theground conductor 24. The via-hole conductors B1 to B3 are produced froma metal material containing silver or copper as a principal componentand having a low specific resistance.

The protective layer 14 covers the substantially entire back surface ofthe dielectric sheet 18 a. Thus, the protective layer 14 covers theground conductor 22. The protective layer 14 is formed from, forexample, flexible resin such as a resist material.

In addition, the protective layer 14 is composed of a line portion 14 aand connection portions 14 b and 14 c as shown in FIG. 2. The lineportion 14 a covers the entire back surface of the line portion 18 a-a,thereby covering the line portion 22 a.

The connection portion 14 b is connected to an end of the line portion14 a on the negative direction side in the x-axis direction and coversthe back surface of the connection portion 18 a-b. However, openings Hato Hd are provided in the connection portion 14 b. The opening Ha is arectangular opening provided at the center of the connection portion 14b. The external terminal 16 a is exposed to the outside through theopening Ha. In addition, the opening Hb is a rectangular openingprovided on the positive direction side of the opening Ha in the y-axisdirection. The opening Hc is a rectangular opening provided on thenegative direction side of the opening Ha in the x-axis direction. Theopening Hd is a rectangular opening provided on the negative directionside of the opening Ha in the y-axis direction. The terminal portion 22b is exposed to the outside through the openings Hb to Hd, therebyserving as an external terminal.

The connection portion 14 c is connected to an end of the line portion14 a on the positive direction side in the x-axis direction and coversthe back surface of the connection portion 18 a-c. However, openings Heto Hh are provided in the connection portion 14 c. The opening He is arectangular opening provided at the center of the connection portion 14c. The external terminal 16 b is exposed to the outside through theopening He. In addition, the opening Hf is a rectangular openingprovided on the positive direction side of the opening He in the y-axisdirection. The opening Hg is a rectangular opening provided on thepositive direction side of the opening He in the x-axis direction. Theopening Hh is a rectangular opening provided on the negative directionside of the opening He in the y-axis direction. The terminal portion 22c is exposed to the outside through the openings Hf to Hh, therebyserving as an external terminal.

The high dielectric constant layer 15 is provided on the first principalsurface of the dielectric element assembly 12 and covers thesubstantially entire front surface of the dielectric sheet 18 c. Thus,the high dielectric constant layer 15 covers the ground conductor 24 andoverlaps the openings 30. For the high dielectric constant layer 15, forexample, a material obtained by mixing a dielectric filler withpolyimide is used, and the high dielectric constant layer 15 has arelative dielectric constant ∈2 higher than the relative dielectricconstant ∈1 of the dielectric element assembly 12. The relativedielectric constant ∈2 of the high dielectric constant layer 15 is, forexample, 4. It is desired that the relative dielectric constant ∈2 ofthe high dielectric constant layer 15 is high, and in order to suppressformation of a stray capacitance within the high-frequency signaltransmission line 10, the relative dielectric constant ∈2 is desirablyequal to or less than 10.

In addition, the high dielectric constant layer 15 is composed of a lineportion 15 a and connection portions 15 b and 15 c as shown in FIG. 2.The line portion 15 a covers the substantially entire front surface ofthe line portion 18 c-a, thereby covering the line portion 24 aincluding a plurality of the openings 30.

The connection portion 15 b is connected to an end of the line portion15 a on the negative direction side in the x-axis direction and coversthe substantially entire front surface of the connection portion 18 c-b.The connection portion 15 c is connected to an end of the line portion15 a on the positive direction side in the x-axis direction and coversthe substantially entire front surface of the connection portion 18 c-c.

The connectors 100 a and 100 b are mounted on the back surfaces of theconnection portions 12 b and 12 c, respectively. The connectors 100 aand 100 b have the same configuration, and thus will be described belowwith the configuration of the connector 100 b as an example.

The connector 100 b is composed of a connector body 102, externalterminals 104 and 106, a central conductor 108, and an externalconductor 110 as shown in FIGS. 1 and 5. The connector body 102 isformed in a shape in which a cylinder is connected to a rectangularplate, and is produced from insulating material such as resin.

The external terminal 104 is provided on a surface of the plate of theconnector body 102 on the negative direction side in the z-axisdirection and at a position facing the external terminal 16 b. Theexternal terminal 106 is provided on the surface of the plate of theconnector body 102 on the negative direction side in the z-axisdirection and at a position corresponding to the terminal portion 22 cexposed through the openings Hf to Hh.

The central conductor 108 is provided at the center of the cylinder ofthe connector body 102 and connected to the external terminal 104. Thecentral conductor 108 is a signal terminal to or from which ahigh-frequency signal is inputted or outputted. The external conductor110 is provided on the inner peripheral surface of the cylinder of theconnector body 102 and connected to the external terminal 106. Theexternal conductor 110 is a ground terminal maintained at a groundpotential.

The connector 100 b configured as described above is mounted on the backsurface of the connection portion 12 c such that the external terminal104 is connected to the external terminal 16 b and the external terminal106 is connected to the terminal portion 22 c. Thus, the signal line 20is electrically connected to the central conductor 108. In addition, theground conductors 22 and 24 are electrically connected to the externalconductor 110.

The high-frequency signal transmission line 10 is used as describedbelow. FIG. 6A is diagrams of an electronic device 200 in which thehigh-frequency signal transmission line 10 is used, as seen in a planarview from the y-axis direction. FIG. 6B is diagrams of an electronicdevice 200 in which the high-frequency signal transmission line 10 isused, as seen in a planar view from the z-axis direction.

The electronic device 200 includes the high-frequency signaltransmission line 10, circuit boards 202 a and 202 b, receptacles 204 aand 204 b, a battery pack (metal body) 206, and a housing 210.

For example, a transmission circuit or reception circuit including anantenna is provided on the circuit board 202 a. For example, a powersupply circuit is provided on the circuit board 202 b. The battery pack206 is, for example, a lithium ion secondary battery and has a structurein which a front surface thereof is covered with a metal cover. Thecircuit board 202 a, the battery pack 206, and the circuit board 202 bare arranged in order from the negative direction side to the positivedirection side in the x-axis direction.

The receptacles 204 a and 204 b are provided on the principal surfacesof the circuit boards 202 a and 202 b, respectively, on the negativedirection side in the z-axis direction. The receptacles 204 a and 204 bare connected to the connectors 100 a and 100 b, respectively. Thus, ahigh-frequency signal transmitted between the circuit boards 202 a and202 b and having a frequency of, for example, 2 GHz is applied to thecentral conductors 108 of the connectors 100 a and 100 b via thereceptacles 204 a and 204 b. In addition, the external conductor 110 ofthe connectors 100 a and 100 b are maintained at the ground potentialvia the circuit boards 202 a and 202 b and the receptacles 204 a and 204b. Thus, the high-frequency signal transmission line 10 electrically andphysically connect between the circuit boards 202 a and 202 b.

Here, the protective layer 14 is in contact with the battery pack 206 asshown in FIG. 6A and FIG. 6B. The protective layer 14 and the batterypack 206 are fixed to each other by means of an adhesive or the like.The protective layer 14 is located on the ground conductor 22 side withrespect to the signal line 20. Thus, the solid ground conductor 22(extending continuously in the x-axis direction) is located between thesignal line 20 and the battery pack 206.

(Method for Manufacturing High-Frequency Signal Transmission Line)

Hereinafter, a method for manufacturing the high-frequency signaltransmission line 10 will be described with reference to FIG. 2. In thefollowing, the case where a single high-frequency signal transmissionline 10 is produced will be described as an example. However, inreality, a plurality of high-frequency signal transmission lines 10 issimultaneously produced by laminating and cutting large dielectricsheets.

First, the dielectric sheets 18 that have copper foil formed on theentireties of the surfaces thereof and are formed from thermoplasticresin are prepared. For example, the surfaces of the copper foils of thedielectric sheets 18 are smoothened by providing zinc plating forcorrosion prevention thereon. The dielectric sheets 18 are liquidcrystal polymers having thicknesses of 20 μm to 80 μm. In addition, thethickness of the copper foil is 10 μm to 20 μm.

Next, the external terminals 16 and the ground conductor 22 shown inFIG. 2 are formed on the back surface of the dielectric sheet 18 a by aphotolithographic process. Specifically, resists having the same shapesas those of the external terminals 16 (16 a and 16 b) and the groundconductor 22 shown in FIG. 2 are printed on the copper foil of thedielectric sheet 18 a. Then, etching treatment is performed on thecopper foil to remove the portion of the copper foil that is not coveredwith the resists. Then, the resists are removed. By so doing, theexternal terminals 16 and the ground conductor 22 as shown in FIG. 2 areformed on the front surface of the dielectric sheet 18 a.

Next, the signal line 20 shown in FIG. 2 is formed on the front surfaceof the dielectric sheet 18 b by a photolithographic process. Inaddition, the ground conductor 24 shown in FIG. 2 is formed on the frontsurface of the dielectric sheet 18 c by a photolithographic process.These photolithographic processes are the same as the photolithographicprocess performed when forming the external terminals 16 and the groundconductor 22, and thus the description thereof is omitted.

Next, a laser beam is applied to locations on the dielectric sheets 18 ato 18 c where the via-hole conductors b1 to b4 and B1 to B3 are to beformed, to form through-holes. Then, the through-holes formed in thedielectric sheets 18 a and 18 b are filled with a conductive paste.

Next, the dielectric sheets 18 a to 18 c are stacked in order from thepositive direction side to the negative direction side in the z-axisdirection such that the ground conductor 22, the signal line 20, and theground conductor 24 have a stripline structure. Then, heat and pressureare applied to the dielectric sheets 18 a to 18 c from the positivedirection side and the negative direction side in the z-axis direction,to soften the dielectric sheets 18 a to 18 c to compression-bond andintegrate the dielectric sheets 18 a to 18 c. The conductive pastefilled in the through-holes is solidified to form the via-holeconductors b1 to b4 and B1 to B3 shown in FIG. 2. Each dielectric sheet18 may be integrated to each other by means of an adhesive such as epoxyresin instead of thermocompression bonding. In addition, the via-holeconductors b1 to b4 and B1 to B3 may be formed by integrating thedielectric sheets 18, then forming through-holes, and filling thethrough-holes with a conductive paste or forming a plating film in thethrough-holes.

Next, a paste obtained by mixing a filler with polyimide is applied tothe front surface of the dielectric sheet 18 c to form the highdielectric constant layer 15.

Lastly, a resin (resist) paste is applied to the back surface of thedielectric sheet 18 a to form the protective layer 14. Thus, thehigh-frequency signal transmission line 10 shown in FIG. 1 is obtained.

(Advantages)

According to the high-frequency signal transmission line 10 configuredas described above, unwanted radiation can be reduced. Morespecifically, in the high-frequency signal transmission line 10, thehigh dielectric constant layer 15 has a relative dielectric constant ∈2higher than the relative dielectric constant ∈1 of the dielectricelement assembly 12 and is provided on the first principal surface ofthe dielectric element assembly 12 so as to overlap the openings 30 inthe ground conductor 24. Thus, as described below, more electromagneticfields radiated from the signal line 20 are reflected at the interfacebetween the high dielectric constant layer 15 and an air layer into thehigh-frequency signal transmission line 10.

In a high-frequency signal transmission line according to a comparativeexample in which a dielectric sheet formed from the same material asthat of the dielectric element assembly is laminated on the groundconductor 24, the difference in relative dielectric constant at theinterface between the dielectric sheet and an air layer is ∈1-1.Meanwhile, in the high-frequency signal transmission line 10, thedifference in relative dielectric constant at the interface between thehigh dielectric constant layer 15 and the air layer is ∈2-1. Since therelative dielectric constant ∈2 is higher than the relative dielectricconstant ∈1, ∈2-1 is higher than ∈1-1. Here, when the difference in therelative dielectric constant at the interface increases, an amount of anelectromagnetic field reflected at the interface increases. Thus, anamount of an electromagnetic field reflected at the interface of thehigh-frequency signal transmission line 10 is larger than an amount ofan electromagnetic field at the interface of the high-frequency signaltransmission line according to the comparative example. In other words,in the high-frequency signal transmission line 10, more electromagneticfields are reflected at the interface between the high dielectricconstant layer 15 and the air layer into the high-frequency signaltransmission line 10, as indicated by an electromagnetic field F1 inFIG. 4, and thus leakage of an electromagnetic field as unwantedradiation to the outside of the high-frequency signal transmission line10 is suppressed. Further, in the high-frequency signal transmissionline 10, the same phenomenon as that at the interface between the highdielectric constant layer 15 and the air layer occurs also at theinterface between the high dielectric constant layer 15 and thedielectric sheet 18 c, as indicated by an electromagnetic field F2 inFIG. 4. Thus, in the high-frequency signal transmission line 10,unwanted radiation is more effectively reduced.

In addition, according to the high-frequency signal transmission line10, a plurality of the openings 30 is provided in the ground conductor24, and thus the high-frequency signal transmission line 10 can easilybe bent.

In addition, according to the high-frequency signal transmission line10, deviation of the characteristic impedance of the signal line 20 froma predetermined characteristic impedance (e.g., 50Ω) can be suppressed.More specifically, in the flexible board described in JapaneseUnexamined Patent Application Publication No. 2007-123740, there is thepossibility that an electromagnetic field will leak through the openingto the outside of the flexible board. Thus, when a dielectric body, ametal body, or the like is provided on the periphery of the flexibleboard, electromagnetic coupling occurs between the signal line of theflexible board and the dielectric body, the metal body, or the like. Asa result, there is the possibility that the characteristic impedance ofthe signal line of the flexible board will deviate from a predeterminedcharacteristic impedance.

Meanwhile, in the high-frequency signal transmission line 10, the backsurface of the dielectric element assembly 12 which is located on theground conductor 22 side with respect to the signal line 20 is incontact with the battery pack 206. In other words, the ground conductor22 in which substantially no opening is formed is provided between thesignal line 20 and the battery pack 206, and the ground conductor 24 inwhich the openings 30 are formed is not provided therebetween. Thus,occurrence of electromagnetic coupling between the signal line 20 andthe battery pack 206 is suppressed. As a result, in the high-frequencysignal transmission line 10, deviation of the characteristic impedanceof the signal line 20 from a predetermined characteristic impedance issuppressed.

In addition, according to the high-frequency signal transmission line10, it is possible to easily bend the high-frequency signal transmissionline 10 due to the following reason as well. The characteristicimpedance Z of the high-frequency signal transmission line 10 isrepresented by √(L/C). L is an inductance value of the high-frequencysignal transmission line per unit length. C is a capacitance value ofthe high-frequency signal transmission line per unit length. Thehigh-frequency signal transmission line 10 is designed such that Zbecomes a predetermined characteristic impedance (e.g., 50Ω).

Here, in order to enable the high-frequency signal transmission line 10to be easily bent, decreasing the thickness in the z-axis direction(hereinafter, referred to merely as thickness) of the high-frequencysignal transmission line 10 is considered. However, when the thicknessof the high-frequency signal transmission line 10 is decreased, thedistances between the signal line 20 and the ground conductors 22 and 24decrease, and the capacitance value C increases. As a result, thecharacteristic impedance Z becomes less than the predeterminedcharacteristic impedance.

Thus, it is considered that the line width in the y-axis direction(hereinafter, referred to merely as line width) of the signal line 20 isdecreased to increase an inductance value L of the signal line 20 andthe facing area of the signal line 20 and the ground conductors 22 and24 is decreased to decrease the capacitance value C.

However, it is difficult to accurately form the signal line 20 having anarrow line width.

Thus, in the high-frequency signal transmission line 10, the openings 30are provided in the ground conductor 24. Due to this, the facing area ofthe signal line 20 and the ground conductor 24 decreases and thecapacitance value C decreases. As a result, the high-frequency signaltransmission line 10 can easily be bent while the characteristicimpedance Z is maintained at the predetermined characteristic impedance.

In addition, according to the high-frequency signal transmission line10, the high dielectric constant layer 15 is provided on the groundconductor 24. Due to this, the ground conductor 24 is not exposed to theoutside on the high-frequency signal transmission line 10. Thus, evenwhen another component is disposed on the front surface of thedielectric element assembly 12, the ground conductor 24 does notdirectly face the other component, and hence variation of thecharacteristic impedance of the signal line 20 is suppressed.

(High-Frequency Signal Transmission Line According to First ModifiedExample)

Hereinafter, the configuration of a high-frequency signal transmissionline according to a first modified example will be described withreference to the drawings. FIG. 7 is an exploded diagram of the laminate12 of the high-frequency signal transmission line 10 a according to thefirst modified example. FIG. 8 is a diagram when the high-frequencysignal transmission line 10 a in FIG. 7 is seen through from the z-axisdirection. FIG. 9 is an equivalent circuit diagram of a portion takenout from the high-frequency signal transmission line 10 a according tothe first modified example.

The difference between the high-frequency signal transmission line 10and the high-frequency signal transmission line 10 a is the shape ofeach opening 30. Hereinafter, the configuration of the high-frequencysignal transmission line 10 a will be described mainly with thedifference.

The ground conductor 24 has a ladder shape by alternately providing aplurality of the openings 30 and a plurality of the bridge portions 60along the signal line 20. The openings 30 overlap the signal line 20 asshown in FIG. 8, when being seen in a planar view from the z-axisdirection, and each have a shape that is line-symmetrical about thesignal line 20. In other words, the signal line 20 extends across thecenters of the openings 30 in the y-axis direction.

Further, the openings 30 each have a shape that is line-symmetricalabout a straight line A that passes through the centers of the openings30 in the direction in which the signal line 20 extends (in the x-axisdirection) and that is orthogonal to the signal line 20 (namely, extendsin the y-axis direction). A detailed description will be given below.

A region including the center of each opening 30 in the x-axis directionis defined as a region A1. In addition, a region corresponding to eachbridge portion 60 is defined as a region A2. Further, a region locatedbetween the region A1 and the region A2 is referred to as a region A3.The regions A3 are located on both sides of each region A1 in the x-axisdirection and are each adjacent to the region A1 and the region A2. Thelength of each region A2 in the x-axis direction (i.e., the length ofeach bridge portion 60) is, for example, 25 to 200 μm. In the presentpreferred embodiment, the length of each region A2 in the x-axisdirection is 100 μm.

The straight line A passes through the center of the region A1 in thex-axis direction as shown in FIG. 8. The width W1 of the opening 30 inthe region A1 in a direction orthogonal to the signal line 20 (in they-axis direction) is larger than the width W2 of the opening 30 in eachregion A3 in the y-axis direction. In other words, each opening 30 has ashape in which a central portion of the opening 30 in the x-axisdirection is wider than any other portions of the opening 30, and has ashape that is line-symmetrical about the straight line A. In eachopening 30, a region in which the width in the y-axis direction is thewidth W1 is the region A1, and regions in which the width in the y-axisdirection is the width W2 are the regions A3. Thus, steps are present atthe boundaries between the regions A1 and A3 of the opening 30. Thewidth W1 is, for example, 500 to 1500 μm. In the present preferredembodiment, the width W1 is 900 μm. In addition, the width W2 is, forexample, 250 to 750 μm. In the present preferred embodiment, the widthW2 is 480 μm.

In addition, the length G1 of each opening 30 in the x-axis directionis, for example, 1 to 5 mm. In the present preferred embodiment, thelength G1 is 3 mm. Here, the length G1 is longer than the width W1 thatis the maximum width of each opening 30. The length G1 is preferablyequal to or larger than twice that of the width W1.

In addition, in the ground conductor 24, no opening is provided betweenthe adjacent openings 30. More specifically, in the region A2 sandwichedbetween the adjacent openings 30, the conductor layer (the bridgeportion 60) uniformly extends and no opening is present.

In the high-frequency signal transmission line 10 a configured asdescribed above, between the adjacent two bridge portions 60, thecharacteristic impedance of the signal line 20 varies so as to increaseto a minimum value Z2, an intermediate value Z3, and a maximum value Z1in order and then decrease to the maximum value Z1, the intermediatevalue Z3, and the minimum value Z2 in order as distance from one bridgeportion 60 increases toward the other bridge portion 60. Morespecifically, each opening 30 has a width W1 in the region A1, and has,in each region A3, a width W2 smaller than the width W1. Thus, thedistance between the signal line 20 and the ground conductor 24 in theregion A1 is larger than the distance between the signal line 20 and theground conductor 24 in each region A3. Due to this, the intensity of amagnetic field occurring in the signal line 20 in the region A1 isgreater than the intensity of a magnetic field occurring in the signalline 20 in each region A3, and an inductance component in the region A1increases. In other words, the L factor is dominant in the region A1.

Further, the bridge portion 60 is provided in each region A2. Thus, thedistance between the signal line 20 and the ground conductor 24 in eachregion A3 is larger than the distance between the signal line 20 and theground conductor 24 in each region A2. Due to this, a capacitanceoccurring in the signal line 20 in each region A2 is greater than acapacitance occurring in the signal line 20 in each region A3, and theintensity of a magnetic field in each region A2 is less than theintensity of the magnetic field in each region A3. In other words, the Cfactor is dominant in each region A2.

Due to the above, the characteristic impedance of the signal line 20 isthe maximum value Z1 in the region A1. In other words, each opening 30has a width W1 at a position where the characteristic impedance of thesignal line 20 is the maximum value Z1. In addition, the characteristicimpedance of the signal line 20 is the intermediate value Z3 in eachregion A3. In other words, each opening 30 has a width W2 at positionswhere the characteristic impedance of the signal line 20 is theintermediate value Z3. Moreover, the characteristic impedance of thesignal line 20 is the minimum value Z2 in each region A2.

Thus, the high-frequency signal transmission line 10 a has a circuitconfiguration shown in FIG. 9. More specifically, in the region A1,almost no capacitance occurs between the signal line 20 and the groundconductor 24, and thus the characteristic impedance Z1 mainly occurs byan inductance L1 of the signal line 20. In addition, in each region A2,a large capacitance C3 occurs between the signal line 20 and the groundconductor 24, and thus the characteristic impedance Z2 mainly occurs bythe capacitance C3. Further, in each region A3, a capacitance C2 smallerthan the capacitance C3 occurs between the signal line 20 and the groundconductor 24, and thus the characteristic impedance Z3 occurs by aninductance L2 of the signal line 20 and the capacitance C2. Moreover,the characteristic impedance Z3 is, for example, 55Ω. The characteristicimpedance Z1 is higher than the characteristic impedance Z3, and is, forexample, 70Ω. The characteristic impedance Z2 is lower than thecharacteristic impedance Z3, and is, for example, 30Ω. In addition, thecharacteristic impedance of the entire high-frequency signaltransmission line 10 a is 50Ω.

According to the high-frequency signal transmission line 10 a, betweenthe adjacent two bridge portions 60, the characteristic impedance of thesignal line 20 varies so as to increase to the minimum value Z2, theintermediate value Z3, and the maximum value Z1 in order and thendecrease to the maximum value Z1, the intermediate value Z3, and theminimum value Z2 in order as distance from one bridge portion 60increases toward the other bridge portion 60. Thus, decrease inthickness of the high-frequency signal transmission line 10 a can beachieved, and even though the thickness is small, the electrode width ofthe signal line 20 can be increased. Thus, the surface areas ofelectrode portions in the signal line 20 and the ground conductors 22and 24 where a high-frequency current flows can be increased, and thetransmission loss of a high-frequency signal is decreased. In addition,as shown in FIG. 8, the length AL of one cycle (a region A1, two regionsA2, and a region A3) is 1 to mm and is small. Thus, even in a higherfrequency range, unwanted radiation can be suppressed and thetransmission loss can be improved. Further, since the regions A3 arelocated on both ends of the region A1, an intense magnetic fieldoccurring due to a current flowing through the signal line 20 is nottransmitted directly to each region A2. Thus, a ground potential in eachregion A2 is stabilized and the shielding effect of the ground conductor24 is maintained. Due to this, occurrence of unwanted radiation can besuppressed. As a result, in the high-frequency signal transmission line10 a, even when the distances between the signal line 20 and the groundconductors 22 and 24 are decreased, the line width of the signal line 20can be increased, and it is possible to decrease the thickness of thehigh-frequency signal transmission line 10 a having decreasedtransmission loss and reduced unwanted radiation with the characteristicimpedance maintained. Thus, it is possible to easily bend thehigh-frequency signal transmission line 10 a, and it is possible to bendand use the high-frequency signal transmission line 10 a.

In addition, according to the high-frequency signal transmission line 10a, the transmission loss can be reduced with stabilization of the groundpotential in the ground conductor 24, and further shieldingcharacteristics can be improved. More specifically, in thehigh-frequency signal transmission line 10 a, the width W1 of eachopening 30 in the region A1 is larger than the width W2 of the opening30 in each region A3. Thus, in the high-frequency signal transmissionline 10 a, the magnetic field energy of the signal line 20 located inthe region A1 is higher than the magnetic field energy of the signalline 20 located in each region A3. In addition, the magnetic fieldenergy of the signal line 20 located in each region A2 is lower than themagnetic field energy of the signal line 20 located in each region A3.Thus, the characteristic impedance of the signal line repeatedly variesto Z2, Z3, Z1, Z3, Z2, in order. Therefore, in the signal line 20, thevariation of the magnetic field energy in portions adjacent to eachother in the x-axis direction becomes gentle. As a result, the magneticfield energy becomes small in the boundary between the unit structures(the regions A1 to A3), the variation of the ground potential in theground conductor is suppressed, and occurrence of unwanted radiation andthe transmission loss of a high-frequency signal are suppressed. Inother words, occurrence of an unwanted inductance component in eachbridge portion 60 can be suppressed by each region A3. As a result, amutual inductance component between each bridge portion 60 and thesignal line 20 can be decreased, and the ground potential can also bestabilized. Thus, even though the high-frequency signal transmissionline is small in thickness and has the relatively large openings 30 inthe ground conductor, unwanted radiation can be reduced and thetransmission loss of a high-frequency signal can be decreased.

In addition, since the via-hole conductors B1 to B3 are arranged in theextending direction of each bridge portion 60, occurrence of an unwantedinductance component in each bridge portion 60 can be furthersuppressed. Particularly, since the length G1 of each opening 30 in thex-axis direction (i.e., the length between the bridge portions 60) islonger than the width W1 of the opening portion in the region A1,occurrence of unwanted radiation can be suppressed even while the areaof each opening 30 is increased as much as possible and a predeterminedcharacteristic impedance is accomplished.

In addition, the openings 30 have unit structures that are periodicallyarranged in the direction in which the signal line 20 extends (in thex-axis direction). Thus, the frequency characteristics of thecharacteristic impedance of the signal line 20 in each opening 30 can bedetermined by the length of the opening 30 in the x-axis direction. Inother words, the frequency characteristics of the characteristicimpedance of the signal line 20 can expand to a higher frequency rangeas the length G1 of each opening 30 decreases. As the length G1 of eachopening 30 increases, the width W1 of the region A1 can be decreased andeach opening 30 can be narrowed. Thus, unwanted radiation can be reducedand the transmission loss can be decreased, and hence expansion of theband of and stabilization of the impedance characteristics of thehigh-frequency signal transmission line 10 a can be achieved.

In addition, due to the following reason as well, it is possible to bendand use the high-frequency signal transmission line 10 a. In thehigh-frequency signal transmission line 10 a, the region A1 is theeasiest to bend since the width of the opening 30 in the y-axisdirection is the largest. Meanwhile, each region A2 is the mostdifficult to bend since no opening 30 is provided therein. Thus, whenthe high-frequency signal transmission line 10 a is bent and used, theregion A1 is bent, and each region A2 is hardly bent. Therefore, in thehigh-frequency signal transmission line 10 a, the via-hole conductors B1to B3 which are more difficult to deform than the dielectric sheets 18are provided in each region A2. Thus, it is possible to easily bend theregion A1.

It is noted that in the high-frequency signal transmission line 10 a, apredetermined characteristic impedance can be obtained even by adjustingthe magnitude of the distance T1 between the signal line 20 and theground conductor 22 and the magnitude of the distance T2 between thesignal line 20 and the ground conductor 24.

In addition, in the high-frequency signal transmission line 10 a, due tothe reason described below, the length G1 of each opening 30 in thedirection in which the signal line 20 extends is larger than the widthW1. More specifically, a transmission mode of a high-frequency signal inthe high-frequency signal transmission line 10 is a TEM mode. In the TEMmode, an electric field and a magnetic field are formed so as to beorthogonal to a direction in which a high-frequency signal istransmitted (the x-axis direction). In other words, a magnetic fieldoccurs so as to draw a circle having a center at the signal line 20, andan electric field occurs radially from the signal line 20 toward theground conductors 22 and 24. Here, when the openings 30 are provided inthe ground conductor 22, a magnetic field draws a circle, and thus,merely expands such that the radius thereof increases in each opening 30and does not greatly leak to the outside of the high-frequency signaltransmission line 10 a. Meanwhile, a portion of an electric field isradiated to the outside of the high-frequency signal transmission line10 a. Thus, in unwanted radiation of the high-frequency signaltransmission line 10 a, electric field radiation occupies a largeproportion.

Here, since the electric field is orthogonal to the direction in which ahigh-frequency signal is transmitted (the x-axis direction), when thewidth W1 of each opening 30 in the y-axis direction increases, an amountof an electric field radiated from each opening 30 increases (unwantedradiation increases). Meanwhile, the characteristic impedance of thehigh-frequency transmission line 10 a can be increased as the width W1is increased. However, in the high-frequency transmission line 10 a, theelectric field almost disappears at a distance that is about three timesthat of the line width of the signal line 20, from the signal line 20 inthe direction orthogonal to the direction in which a high-frequencysignal is transmitted (the x-axis direction). Thus, even when the widthW1 is increased further, the characteristic impedance cannot beincreased further. Therefore, when it is considered that unwantedradiation increases as the width W1 increases, it is not preferable toincrease the width W1 more than necessary. Further, when the width W1nearly reaches ½ of the wavelength of a high-frequency signal,electromagnetic waves are radiated as a slot antenna, and unwantedradiation is increased further.

Meanwhile, the area of the signal line 20 that faces the groundconductor 22 can be decreased as the length G1 of each opening 30 in thex-axis direction is increased. Thus, it is possible to increase the linewidth of the signal line 20. Due to this, an advantage that thehigh-frequency resistance value in the signal line 20 can be decreasedis provided.

In addition, when the length G1 is larger than the width W1, thehigh-frequency resistance value of a reverse current (eddy current) inthe ground conductor 22 is decreased.

Due to the above, the length G1 is preferably larger than the width W1,and is preferably equal to or larger than twice that of the width W1.However, when the length G1 of each opening 30 in the x-axis directionis close to ½ of the wavelength of a high-frequency signal,electromagnetic waves are radiated from the opening 30 as a slotantenna. Thus, it should be taken into consideration that the length G1needs to be sufficiently short with respect to the wavelength.

(High-Frequency Signal Transmission Line According to Second ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to asecond modified example will be described with reference to the drawing.FIG. 10 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 b according to the second modified example.

The difference between the high-frequency signal transmission line 10 band the high-frequency signal transmission line 10 a is the shape ofeach opening 30. More specifically, in the high-frequency signaltransmission line 10 a, the width of each opening 30 in the y-axisdirection changes discontinuously in a phased manner as shown in FIG. 7.In contrast, in the high-frequency signal transmission line 10 b, thewidth of each opening in the y-axis direction changes continuously. Morespecifically, the width of each opening 30 in the y-axis directioncontinuously decreases as distance from the center of the opening 30 inthe x-axis direction increases. Thus, the magnetic field energy and thecharacteristic impedance of the signal line 20 change continuously.

It is noted that in the high-frequency signal transmission line 10 b, asshown in FIG. 10, a region A1 is provided so as to have a center at thestraight line A and is a region including a portion where the width ofthe opening 30 in the y-axis direction is the width W1. Therefore, thecharacteristic impedance of the signal line 20 is the maximum value Z1within the region A1. In addition, a region A2 is provided between eachopening 30 and is a region in which the bridge portion 60 is provided.Therefore, the characteristic impedance of the signal line 20 is theminimum value Z2 within the region A2. Further, a region A3 issandwiched between the region A1 and the region A2 and is a regionincluding a portion where the width of the opening 30 in the y-axisdirection is the width W2. Therefore, the characteristic impedance ofthe signal line 20 is the intermediate value Z3 within the region A3.

Here, the region A1 suffices to include the portion where the width ofthe opening 30 in the y-axis direction is the width W1, and the regionA3 suffices to include the portion where the width of the opening 30 inthe y-axis direction is W2. Thus, in the present preferred embodiment,the boundary between the region A1 and the region A3 is not particularlyclearly determined. Here, the boundary between the region A1 and theregion A3 is located, for example, at a position where the width of theopening 30 in the y-axis direction is (W1+W2)/2.

The high-frequency signal transmission line 10 b having theconfiguration as described above also can be bent and used similarly tothe high-frequency signal transmission line 10, unwanted radiation canbe reduced, and further transmission loss within the signal line 20 canbe suppressed.

(High-Frequency Signal Transmission Line According to Third ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to athird modified example will be described with reference to the drawing.FIG. 11 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 c according to the third modified example.

The difference between the high-frequency signal transmission line 10 cand the high-frequency signal transmission line 10 a is presence/absenceof ground conductors 40 and 42. More specifically, in the high-frequencysignal transmission line 10 c, the ground conductors 40 and 42 areprovided on the front surface of the dielectric sheet 18 b. The groundconductor 40 is a rectangular conductor that extends in the x-axisdirection on the positive direction side in the y-axis direction withrespect to the signal line 20. The ground conductor 40 is connected tothe ground conductors 22 and 24 via the via-hole conductors B1 to B3. Inaddition, the ground conductor 42 is a rectangular conductor thatextends in the x-axis direction on the negative direction side in they-axis direction with respect to the signal line 20. The groundconductor 42 is connected to the ground conductors 22 and 24 via thevia-hole conductors B1 to B3.

In the high-frequency signal transmission line 10 c as described above,the ground conductors 40 and 42 are provided on both sides of the signalline 20 in the y-axis direction, and thus leakage of unwanted radiationfrom the signal line 20 to both sides thereof in the y-axis direction issuppressed.

(High-Frequency Signal Transmission Line According to Fourth ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to afourth modified example will be described with reference to the drawing.FIG. 12 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 d according to the fourth modified example.

The difference between the high-frequency signal transmission line 10 dand the high-frequency signal transmission line 10 a is that the shapesof the openings 30 and the shapes of openings 44 a and 44 b aredifferent from each other. More specifically, the openings 44 a and 44 bhave a shape obtained by dividing the opening 30 into two portions onthe positive direction side and the negative direction side in they-axis direction. In the high-frequency signal transmission line 10 d, aline-shaped conductor 46 is provided so as to extend between theopenings 44 a and 44 b. The line-shaped conductor 46 forms a portion ofthe ground conductor 24 and overlaps the signal line 20 when being seenin a planar view from the z-axis direction. However, in thehigh-frequency signal transmission line 10 d, the line width of theline-shaped conductor 46 is smaller than the line width of the signalline 20 as shown in FIG. 12. Thus, the signal line 20 protrudes from theline-shaped conductor 46 in a planar view in the z-axis direction. Thus,the signal line 20 overlaps the openings 44 a and 44 b.

In the high-frequency signal transmission line 10 d as described above,a plurality of the openings 44 a are provided so as to be arranged alongthe signal line 20, and a plurality of the openings 44 b are provided soas to be arranged along the signal line 20. Thus, the characteristicimpedance of the signal line 20 in each region A1 is the maximum valueZ1. In addition, the characteristic impedance of the signal line 20 ineach region A3 is the intermediate value Z3. Further, the characteristicimpedance of the signal line 20 in each region A2 is the minimum valueZ2.

(High-Frequency Signal Transmission Line According to Fifth ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to afifth modified example will be described with reference to the drawings.FIG. 13 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 e according to the fifth modified example.FIG. 14 is a diagram when the high-frequency signal transmission line 10e in FIG. 13 is seen through from the z-axis direction.

A first difference between the high-frequency signal transmission line10 e and the high-frequency signal transmission line 10 a is that theline width of the signal line 20 in each bridge portion 60 is smallerthan the line width of the signal line 20 in a position where thecharacteristic impedance of the signal line 20 is the maximum value Z1.A second difference between the high-frequency signal transmission line10 e and the high-frequency signal transmission line 10 a is that eachopening is formed in a tapered shape between a position where thecharacteristic impedance of the signal line 20 is the intermediate valueZ3 (i.e., a position where the width of the opening 30 in the y-axisdirection is the width W2) and a position where the characteristicimpedance of the signal line 20 is the maximum value Z1 (i.e., aposition where the width of the opening 30 in the y-axis direction isthe width W1). A third difference between the high-frequency signaltransmission line 10 e and the high-frequency signal transmission line10 a is that each opening 30 is formed in a tapered shape between aposition where the characteristic impedance of the signal line 20 is theintermediate value Z3 (i.e., a position where the width of the opening30 in the y-axis direction is the width W2) and the bridge portion 60.

First, the definition of the regions A1 to A3 in the high-frequencysignal transmission line 10 e will be described with reference to FIG.14. The region A1 is a region where the width of the opening 30 in they-axis direction is the width W1. The region A2 is a regioncorresponding to the bridge portion 60. The region A3 is a region thatis sandwiched between the region A1 and the region A2 and includes aregion where the width of the opening 30 in the y-axis direction is thewidth W2.

The first difference will be described. As shown in FIGS. 13 and 14, theline width of the signal line 20 in the region A2 is a line width Wb.Meanwhile, the line width of the signal line 20 in the region A1 is aline width Wa larger than the line width Wb. The line width Wa is, forexample, 100 to 500 μm. In the present preferred embodiment, the linewidth Wa is 350 μm. The line width Wb is, for example, 25 to 250 μm. Inthe present preferred embodiment, the line width Wb is 100 μm. Since theline width of the signal line 20 in the region A2 is smaller than theline width of the signal line 20 in the region A1 as described above,the area where the signal line 20 and the bridge portion 60 overlap eachother is decreased. As a result, a stray capacitance occurring betweenthe signal line 20 and the bridge portion 60 is reduced. Further, sincethe line width of a portion of the signal line 20 which overlaps theopening 30 is the line width Wa, an increase in the inductance value ofthe portion of the signal line 20 is suppressed. Moreover, since theline width of the entirety of the signal line 20 is not decreased butthe line width of the signal line 20 is partially decreased, an increasein the resistance value of the signal line 20 is suppressed.

In addition, the signal line 20 is formed in a tapered shape in aportion where the line width thereof changes. Thus, variation of theresistance value in the portion where the line width of the signal line20 changes becomes gentle, and occurrence of reflection of ahigh-frequency signal in the portion where the line width of the signalline 20 changes is suppressed.

The second difference will be described. Each opening 30 is formed in atapered shape between the position where the width of the opening 30 inthe y-axis direction is the width W2 and the position where the width ofthe opening 30 in the y-axis direction is the width W1. In other words,the end portion of the opening 30 in the x-axis direction in the regionA3 is formed in a tapered shape. Thus, the loss of a current flowingthrough the ground conductor 24 is reduced.

The third difference will be described. Each opening 30 is formed in atapered shape between the position where the width of the opening 30 inthe y-axis direction is the width W2 and the bridge portion 60. Thus,both end portions of the bridge portion 60 in the y-axis direction areformed in tapered shapes. Therefore, the line width of the bridgeportion 60 in the x-axis direction is smaller in a portion overlappingthe signal line 20 than in the other portions. As a result, a straycapacitance occurring between the bridge portion 60 and the signal line20 is reduced. In addition, since the line width of the entirety of thebridge portion 60 is not decreased but the line width of the bridgeportion 60 is partially decreased, increases in the resistance value andthe inductance value of the bridge portion 60 are suppressed.

(High-Frequency Signal Transmission Line According to Sixth ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to asixth modified example will be described with reference to the drawing.FIG. 15 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 f according to the sixth modified example.

The difference between the high-frequency signal transmission line 10 fand the high-frequency signal transmission line 10 is that no bridgeportion 60 is provided in the high-frequency signal transmission line 10f. In other words, the opening 30 in the high-frequency signaltransmission line 10 f is a slit extending in the x-axis direction. Evenin the high-frequency signal transmission line 10 f as described above,unwanted radiation is reduced similarly to the high-frequency signaltransmission line 10. In addition, since no bridge portion 60 ispresent, the high-frequency signal transmission line 10 f can be bentmore easily.

(High-Frequency Signal Transmission Line According to Seventh ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to aseventh modified example will be described with reference to thedrawing. FIG. 16 is an exploded diagram of the laminate 12 of thehigh-frequency signal transmission line 10 g according to the seventhmodified example.

The difference between the high-frequency signal transmission line 10 gand the high-frequency signal transmission line 10 is that openings 70and bridge portions 72 are provided in the ground conductor 22 and thata high dielectric constant layer 64 is provided.

In the high-frequency signal transmission line 10 g, the groundconductor 22 has the same shape as that of the ground conductor 24. Inother words, in the ground conductor 22, a plurality of the openings 70and the bridge portions 72 that overlap the signal line 20 arealternately arranged along the signal line 20.

Further, in the high-frequency signal transmission line 10 g, the highdielectric constant layer 64 is provided instead of the protective layer14. The high dielectric constant layer 64 has the same shape as that ofthe protective layer 14, and has a relative dielectric constant ∈3higher than the relative dielectric constant ∈1 of the dielectricelement assembly 12. The high dielectric constant layer 64 has the sameshape as that of the protective layer 14 and is provided so as tooverlap the openings 70. The high dielectric constant layer 64 is formedfrom, for example, the same material as that of the high dielectricconstant layer 15.

In the high-frequency signal transmission line 10 g configured asdescribed above as well, unwanted radiation is reduced similarly to thehigh-frequency signal transmission line 10.

(High-Frequency Signal Transmission Line According to Eighth ModifiedExample)

Hereinafter, a high-frequency signal transmission line according to aneighth modified example will be described with reference to the drawing.FIG. 17 is an exploded diagram of the laminate 12 of the high-frequencysignal transmission line 10 h according to the eighth modified example.

The difference between the high-frequency signal transmission line 10 hand the high-frequency signal transmission line 10 is that a dielectricsheet 18 d is laminated on the dielectric sheet 18 c. More specifically,the dielectric sheet 18 d is laminated on the negative direction side ofthe dielectric sheet 18 c in the z-axis direction. The high dielectricconstant layer 15 is laminated on the negative direction side of thedielectric sheet 18 d in the z-axis direction. Thus, the groundconductor 24 is sandwiched between the dielectric sheets 18 c and 18 d.In other words, the ground conductor 24 does not have to be provided onthe first principal surface of the dielectric element assembly 12.

In the high-frequency signal transmission line 10 h configured asdescribed above as well, unwanted radiation is reduced similarly to thehigh-frequency signal transmission line 10.

Other Preferred Embodiments

A high-frequency signal transmission line according to the presentinvention is not limited to the high-frequency signal transmission lines10 and 10 a to 10 h according to the preferred embodiments describedabove, and can be modified in a variety of ways within the scope of thepresent invention.

In each of the high-frequency signal transmission lines 10, 10 a to 10e, 10 g, and 10 h, a plurality of the openings 30 have the same shape.However, the shapes of some of a plurality of the openings 30 may bedifferent from the shapes of the others of a plurality of the openings30. For example, the lengths of openings 30 in the x-axis directionother than predetermined openings 30 among a plurality of the openings30 may be larger than the lengths of the predetermined openings 30 inthe x-axis direction. Thus, in a region where the predetermined openings30 are provided, it is possible to easily bend each of thehigh-frequency signal transmission lines 10, 10 a to 10 e, 10 g, and 10h.

It is noted that the configurations shown in the high-frequency signaltransmission lines 10 and 10 a to 10 h may be combined.

In the high-frequency signal transmission lines 10 a to 10 e, 10 g, and10 h, between the adjacent two bridge portions 60, the characteristicimpedance of the signal line 20 varies so as to increase to the minimumvalue Z2, the intermediate value Z3, and the maximum value Z1 in orderand then decrease to the maximum value Z1, the intermediate value Z3,and the minimum value Z2 in order as distance from one bridge portion 60increases toward the other bridge portion 60. However, between theadjacent two bridge portions 60, the characteristic impedance of thesignal line 20 may vary so as to increase to the minimum value Z2, theintermediate value Z3, and the maximum value Z1 in order and thendecrease to the maximum value Z1, an intermediate value Z4, and theminimum value Z2 in order as distance from one bridge portion 60increases toward the other bridge portion 60. In other words, theintermediate value Z3 and the intermediate value Z4 may be differentfrom each other. For example, the openings 30, 44 a, and 44 b may haveshapes that are not line-symmetrical about the straight line A. However,the intermediate value Z4 has to be higher than the minimum value Z2 andlower than the maximum value Z1.

In addition, the minimum value Z2 may be different between the adjacenttwo bridge portions 60. In other words, as long as the entireties of thehigh-frequency signal transmission lines 10 a to 10 f are adjusted topredetermined characteristic impedances, all the minimum values Z2 donot have to be the same. However, the minimum value Z2 on one bridgeportion 60 side has to be lower than the intermediate value Z3, and theminimum value Z2 on the other bridge portion 60 side has to be lowerthan the intermediate value Z4.

In addition, the connectors 100 a and 100 b may be provided on the firstprincipal surface side (front surface side) of the dielectric elementassembly 12.

INDUSTRIAL APPLICABILITY

As described above, the present invention is useful for high-frequencysignal transmission lines, and particularly, is excellent in being ableto reduce unwanted radiation.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A high-frequency signal transmission linecomprising: an element assembly having a first relative dielectricconstant and having a first principal surface and a second principalsurface; a line-shaped signal line provided within the element assembly;a first ground conductor provided on the first principal surface sidewith respect to the signal line and facing the signal line, the firstground conductor being provided with a first opening that overlaps thesignal line; and a first high dielectric constant layer having a secondrelative dielectric constant higher than the first relative dielectricconstant and provided on the first principal surface so as to overlapthe first opening.
 2. The high-frequency signal transmission lineaccording to claim 1, wherein the first ground conductor is provided onthe first principal surface; and the first high dielectric constantlayer covers the first ground conductor.
 3. The high-frequency signaltransmission line according to claim 1, wherein the element assembly iscomposed of a plurality of laminated insulating material layers.
 4. Thehigh-frequency signal transmission line according to claim 1, whereinthe element assembly has flexibility.
 5. The high-frequency signaltransmission line according to claim 1, further comprising a secondground conductor facing the first ground conductor across the signalline in the element assembly.
 6. The high-frequency signal transmissionline according to claim 5, wherein the second ground conductor isprovided with a second opening that overlaps the signal line; thehigh-frequency signal transmission line further comprises a second highdielectric constant layer having a third relative dielectric constanthigher than the first relative dielectric constant and provided on thesecond principal surface so as to overlap the second opening.
 7. Anelectronic device comprising: a component; and a high-frequency signaltransmission line comprising: an element assembly having a firstrelative dielectric constant and having a first principal surface and asecond principal surface; a line-shaped signal line provided within theelement assembly; a first ground conductor provided on the firstprincipal surface side with respect to the signal line and facing thesignal line, the first ground conductor being provided with a firstopening that overlaps the signal line; a second ground conductor facingthe first ground conductor across the signal line in the elementassembly; and a first high dielectric constant layer having a secondrelative dielectric constant higher than the first relative dielectricconstant and provided on the first principal surface so as to overlapwith first opening; wherein the high-frequency signal transmission lineis disposed such that the second principal surface contacts with thecomponent.
 8. The electronic device according to claim 7, wherein theelement assembly is composed of a plurality of laminated insulatingmaterial layers.
 9. The electronic device according to claim 7, whereinthe element assembly has flexibility.
 10. The electronic deviceaccording to claim 7, wherein the component is a battery pack.
 11. Theelectronic device according to claim 7, wherein the first principalsurface of the high-frequency signal transmission line is opposed to acasing of the electronic device at a distance.